The Electroplating Division offers the main raw materials for the copper, chromium, tin, brass, nickel and zinc segments; with production in its own foundry and also by importation and distribution of the best sources, with technical and commercial assistance to guarantee the best results in the different surface treatments.

• ACTIVATED CARBON POWDER
• AMMONIUM BIFLUORIDE
• AMMONIUM CHLORIDE
• AMMONIUM MOLYBDATE
• BARIUM CHLORIDE
• BIDISTILLED WHITE GLYCERIN / USP
• BORAX DECAHYDRATED
• BORIC ACID
• CAUSTIC SODA SCALES
• CHROMIC ACID
• COPPER CYANIDE
• COPPER SULFATE
• ELECTROLYTIC/PHOSPHORUS COPPER BLOOMS
• ELECTROLYTIC/PHOSPHORUS COPPER NUGGETS
• GLACIAL ACETIC ACID
• GLYCOLIC ACID 70%
• HYDROFLUORIC ACID 22 / 35 / 70%
• METHYLENE CHLORIDE
• NICKEL ANODE VARIOUS SIZES
• NICKEL CHLORIDE
• NICKEL CHLORIDE 80% SOLUTION
• NICKEL PELLETS / ROUNDS
• NICKEL SULFATE
• NICKEL SULFATE SOLUTION 60%
• Pb/Sn ANODE
• PHOSPHORIC ACID 85% FG
• POTASSIUM CHLORIDE TECHNICAL
• POTASSIUM CYANIDE GRANULES
• POTASSIUM HYDROXIDE SCALES
• POTASSIUM PERMANGANATE
• SACCHARIN
• SODIUM CHLORATE
• SODIUM CYANIDE POWDER
• SODIUM DICHROMATE DIHYDRATE
• SODIUM GLUCONATE
• SODIUM HYPOPHOSPHITE
• SODIUM METABISULFITE
• SODIUM NITRITE
• TIN METAL GRADE A (PLATES)
• ZINC ANODE BALL / DROP / PLATES / HALF BALL
• ZINC ANODE SHG (Plates 10×60, 20×60, 20×80 cm)
• ZINC CHLORIDE POWDER / SOLUTION
• ZINC CYANIDE
• ZINC OXIDE USP
• ZINC SHG INGOTS